LG Chem Targets Next-Generation Semiconductor Packaging with High-Resolution PID

20 October 2025 - 11:30

LG Chem Targets Next-Generation Semiconductor Packaging with High-Resolution PID

SEOUL, September 29, 2025 – LG Chem announced today that it has completed the development of a liquid photo-imageable dielectric (PID), a key material for advanced semiconductor packaging, and is now gearing up to actively address the demand in AI and other high-performance semiconductor markets.

PID is a photosensitive dielectric material used to form ultra-fine interconnects between semiconductor chips and substrates. By creating pathways for electrical signals and improving circuit fidelity, PID enhances device performance and reliability in advanced packaging processes.

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